| Location | Karnataka Bangalore |
| Category | Engineering |
| Contract | Contract/Freelance |
This Job Description is for the position of Engineer in the Area of Hardware enclosure development for Aerospace industries.
The candidate should be able to Execute Mechanical Engineering design work for Electronics packaging and perform FE Analysis (structural and Thermal).
Execute the FE Analysis of enclosures in the area of Thermal and Structural analysis in Ansys or NX Analysis
Should posses the knowledge of getting the prototype done through the vendors
Should posses the ability to perform Engineering design calculations
Exposure to Six Sigma methodology / statistical methods would be an added advantage.